Effect of N2 plasma treatment on the adhesion of Cu/Ni thin film to polyimide

Mechanical and structural properties of electrodeposited copper and their relation with the electrodeposition parameters

Ángel Ibáñez, E. Fatás · Surface and Coatings Technology · 2004 · 141 citations

Natural Sciences, Materials Engineering, Materials Science +13

The properties of copper films deposited on polyimide by nitrogen and oxygen plasma pre-treatment

Chih-Hao Yang, Shih-Chin Lee, Junming Wu et al. · Applied Surface Science · 2005 · 66 citations

Natural Sciences, Materials Engineering, Materials Science +11

Electrochemical characterization of carbon black subjected to RF oxygen plasma

Xu Li, Kiyoshi Horita · Carbon · 2000 · 56 citations

Natural Sciences, Chemistry, Materials Science +13

Adhesion improvement of epoxy resin/polyimide joints by amine treatment of polyimide surface

H.K. Yun, K. Cho, J.K. Kim et al. · Polymer · 1997 · 46 citations

Natural Sciences, Materials Engineering, Materials Science +12

Diffusion and adhesion properties of Cu films on polyimide substrates

Tongxiang Liang, Y.Q. Liu, Zhongwang Fu et al. · Thin Solid Films · 2004 · 29 citations

Natural Sciences, Materials Engineering, Materials Science +16