Concepedia

H.K. Yun

HY

Statistics

Publications

6

Citations

220

H-Index

6

Active since

1992

Affiliations

Samsung (South Korea)(Current)

Pohang University of Science and Technology

H.K. Yun is an author at Samsung (South Korea) specializing in materials science, engineering, and mechanical engineering.

ORCID

Top concepts

Publications per year

1992–2002

6

Publications

6

Adhesion improvement of copper/epoxy joints

H.K. Yun, K. Cho, J. H. An et al. · Journal of Materials Science · 1992 · 68 citations

, , +5

Adhesion improvement of epoxy resin/polyimide joints by amine treatment of polyimide surface

H.K. Yun, K. Cho, J.K. Kim et al. · Polymer · 1997 · 46 citations

, , +9

Adhesion improvement of epoxy resin/copper lead frame j oints by azole compounds

Sungmin Song, C.E. Park, H.K. Yun et al. · Journal of Adhesion Science and Technology · 1998 · 36 citations

, , +11

Effects of plasma treatment of polyimide on the adhesion strength of epoxy resin / polyimide j oints

H.K. Yun, K. Cho, J.K. Kim et al. · Journal of Adhesion Science and Technology · 1997 · 35 citations

, , +12

Synthesis and characterization of water‐soluble polymeric adhesion promoter for epoxy resin/copper joints

Sungmin Song, K. Cho, C. E. Park et al. · Journal of Applied Polymer Science · 2002 · 18 citations

, , +13

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