Publication | Closed Access
High Phosphorus Dopant Activation in Germanium Using Laser Spike Annealing
10
Citations
28
References
2016
Year
EngineeringOptoelectronic DevicesMinimal Dopant DiffusionSemiconductor DeviceSemiconductorsElectronic DevicesMolecular Beam EpitaxyPulsed Laser DepositionThermal StabilityCompound SemiconductorMaterials ScienceMaterials EngineeringElectrical EngineeringSemiconductor TechnologyPhysicsCrystalline DefectsSemiconductor MaterialLaser Spike AnnealingApplied PhysicsOptoelectronicsGermanene
Germanium n <sup xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">+</sup> /p junctions with high phosphorus dopant activation (>1020 cm <sup xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">-3</sup> ) and minimal dopant diffusion were achieved by P implantation and laser spike annealing (LSA) at temperatures ≥794 °C for 400 μs. In addition, there is no evidence of any residual extended defectivity near the junction after LSA. The effect of F co-doping was also investigated, demonstrating the reduction in both diffusion and activation. The thermal stability and electrical characteristics of Ge n <sup xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">+</sup> /p junction activated by LSA were evaluated.
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