Concepedia

Electromigration Studies of Flip Chip Bump Solder Joints

Medical Entomology and Zoology · 1998 · 79 citations · 0 references

Concepts

EngineeringElectrical EngineeringMaterials EngineeringElectronic MaterialsSemiconductor DevicesChip PackagingMetal-semiconductor ContactsWafer BondingElectromigrationElectromigration AnalysisElectromigration ReliabilityFlip-chip BondingFlip-chip Bumping