Publication | Closed Access
Multi-model simulation of 300 mm silicon-nitride thin-film deposition by PECVD and experimental verification
16
Citations
39
References
2016
Year
Materials EngineeringElectrical EngineeringExperimental VerificationEngineeringMulti-model SimulationMicrofabricationSurface ScienceApplied PhysicsSemiconductor Device FabricationElectronic PackagingThin FilmsMicroelectronicsChemical DepositionChemical Vapor DepositionThin Film Processing
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