Publication | Closed Access
Life distribution properties of devices subject to a pure jump damage process
49
Citations
10
References
1984
Year
Electrical EngineeringReliability EngineeringEngineeringOptimal Replacement ProblemDamage MechanismHardware ReliabilityLife Distribution PropertiesTime-dependent Dielectric BreakdownDamage ProcessProbability TheoryPure Jump ProcessElectronic PackagingDevice ReliabilityMicroelectronicsPhysic Of FailureElectrical Insulation
A device is subject to damage. The damage occurs randomly in time according to a pure jump process. The device has a threshold and it fails once the damage exceeds the threshold. We show that life distribution properties of the threshold right tail probability are inherited as corresponding properties of the survival probability, under suitable conditions on the parameters of the damage process. Moreover we discuss an optimal replacement problem for such devices.
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