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An integrated silicon photonics technology for O-band datacom
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2015
Year
Unknown Venue
O-band DatacomEngineeringDevice IntegrationIntegrated PhotonicsGb/s Reference DesignIntegrated CircuitsManufacturable PlatformProgrammable PhotonicsAdvanced Packaging (Semiconductors)Mixed-signal Integrated CircuitPhotonic Integrated CircuitOptical CommunicationPhotonicsComputer EngineeringMicroelectronicsPhotonic DeviceSilicon PhotonicsApplied PhysicsSelf-aligned Fiber AttachOptoelectronics
A manufacturable platform of CMOS, RF and opto-electronic devices fully PDK enabled to demonstrate a 4×25 Gb/s reference design is presented. With self-aligned fiber attach, this technology enables low-cost O-band data-com transceivers. In addition, this technology can offer enhanced performance and yield in hybrid-assembly for applications at 25 Gbaud and beyond.