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Quantitative Analysis of Porosity and Transport Properties by FIB-SEM 3D Imaging of a Solder Based Sintered Silver for a New Microelectronic Component

Materials ScienceMaterials EngineeringSinteringPowder MetallurgyEngineeringMicrofabricationFib-sem 3DMechanical EngineeringApplied PhysicsQuantitative AnalysisSintered SilverElectronic Packaging3D PrintingMicrostructure