Publication | Open Access
Low-Resistance 2D/2D Ohmic Contacts: A Universal Approach to High-Performance WSe<sub>2</sub>, MoS<sub>2</sub>, and MoSe<sub>2</sub> Transistors
407
Citations
47
References
2016
Year
EngineeringLow-resistance 2D/2dTwo-dimensional MaterialsOptoelectronic DevicesSemiconductor DeviceSemiconductorsElectronic DevicesIntentional DopingQuantum MaterialsLow-resistance Ohmic ContactsUniversal ApproachSemiconductor TechnologyElectrical EngineeringPhysicsSemiconductor Device FabricationOhmic ContactsLayered MaterialMicroelectronicsLow-power ElectronicsTransition Metal ChalcogenidesElectronic MaterialsMose2 FetsApplied PhysicsTopological Heterostructures
We report a new strategy for fabricating 2D/2D low-resistance ohmic contacts for a variety of transition metal dichalcogenides (TMDs) using van der Waals assembly of substitutionally doped TMDs as drain/source contacts and TMDs with no intentional doping as channel materials. We demonstrate that few-layer WSe2 field-effect transistors (FETs) with 2D/2D contacts exhibit low contact resistances of ∼0.3 kΩ μm, high on/off ratios up to >10(9), and high drive currents exceeding 320 μA μm(-1). These favorable characteristics are combined with a two-terminal field-effect hole mobility μFE ≈ 2 × 10(2) cm(2) V(-1) s(-1) at room temperature, which increases to >2 × 10(3) cm(2) V(-1) s(-1) at cryogenic temperatures. We observe a similar performance also in MoS2 and MoSe2 FETs with 2D/2D drain and source contacts. The 2D/2D low-resistance ohmic contacts presented here represent a new device paradigm that overcomes a significant bottleneck in the performance of TMDs and a wide variety of other 2D materials as the channel materials in postsilicon electronics.
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