Influence of active element Ti on interfacial reaction and soldering strength between Sn3.5Ag4Ti(Ce,Ga) alloy filler and Si substrate - Concepedia

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Influence of active element Ti on interfacial reaction and soldering strength between Sn3.5Ag4Ti(Ce,Ga) alloy filler and Si substrate

14

Citations

24

References

2016

Year

Lanxian Cheng, G.Y. Li, X.Q. Wang, Zhenlong Li, Zhaoyu Wu

Materials Science and Engineering A

Materials ScienceMaterials EngineeringInterfacial ReactionSi SubstrateEngineeringPowder MetallurgyCorrosionMechanical EngineeringMetallurgical ProcessActive Element TiMicrostructureMetal Processing

References

	Year	Citations

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