Innovative manufacturing approach for paper‐based substrate integrated waveguide components and antennas

Abstract

This study presents a novel low‐cost manufacturing technique for paper‐based microwave components. In particular, this work is focused on the implementation of substrate integrated waveguide (SIW) passive circuits and antennas. The proposed manufacturing technique requires the preliminary preparation of the metallised paper substrate, obtained by stacking different layers of paper, and eventually gluing two aluminium foils on both faces of the paper substrate. Subsequently, the circuit pattern is obtained by milling machining. Finally, as the SIW structures require metal vias, cylindrical holes are obtained by drilling and then metallised by conductive paste, by adopting a particular technique. The different steps are detailed in this study, and the basic features of the proposed technique are compared with the traditional ink‐jet‐printing technology typically used for paper‐based microwave circuits. Moreover, the fabrication and testing of several SIW components and antennas are presented in a comprehensive way, to demonstrate the potential of the proposed manufacturing technique and its applicability to the development of the next generation of eco‐friendly wireless systems.