Integration of Direct-Write (DW) and Ultrasonic Consolidation (UC) Technologies to Create Advanced Structures with Embedded Electrical Circuitry

Abstract

In many instances conductive traces are needed in small, compact and enclosed areas. However, with traditional manufacturing techniques, embedded electrical traces or antenna arrays have not been a possibility. By integrating Direct Write and Ultrasonic Consolidation technologies, electronic circuitry, antennas and other devices can be manufactured directly into a solid metal structure and subsequently completely enclosed. This can achieve a significant reduction in mass and volume of a complex electronic system without compromising performance.