IEEE Transactions on Power Electronics · 2009 · 53 citations · 11 references
EngineeringElectrical EngineeringHeat TransferPower ElectronicsSemiconductor DevicesConverter TopologiesDevice CharacterizationIntegrated Circuit DevicesSemiconductor ReliabilityThermal ManagementThermal Properties Of SemiconductorsAsymmetrical LayoutBuck ConvertersCouplingsMagnetic CouplingsSwitching LossesThermal Management Of Semiconductor DevicesThermal StabilizationThermal Transients In Electronics
<para xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink"> This paper describes the parallel connection of 4.5 kV integrated gate commutated thyristors (IGCTs) and diodes. The impact of varying device characteristics on the stationary current distribution of parallel connected semiconductors is investigated. Possible solutions to improve the current sharing at steady state are presented. A thermal stabilization effect of parallel connected IGCTs is discussed. Furthermore, the behavior of parallel connected devices during switching transients is investigated experimentally in a 1.5-kV, 5-kA buck converter. Especially, the impact of asymmetrical circuit layouts, magnetic couplings, different turn-<emphasis emphasistype="smcaps">on </emphasis> and turn-<emphasis emphasistype="smcaps">off</emphasis> delays, and junction temperatures are considered. It is shown that a substantial current derating is necessary to enable a reliable operation of parallel IGCTs and diodes. </para>
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Characterization of IGCTs for series connected operation
Andreas Nagel, Steffen Bernet, Thomas Brückner et al. · 2002 · 56 citations