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Application of lock-in thermography for failure analysis in integrated circuits using quantitative phase shift analysis

Electrical EngineeringReliability EngineeringEngineeringHardware ReliabilityFailure AnalysisEngineering Failure AnalysisLock-in ThermographyCircuit ReliabilityIntegrated CircuitsThermodynamicsInstrumentationHeat TransferMicroelectronicsThermal EngineeringElectronic PackagingPhysic Of FailureDevice Reliability