Reflow and Electrical Characteristics of Nanoscale Solder

Abstract

Soldering nanojoints: Nanowires with a diameter range of 30–200 nm were patterned with solder segments, and the reflow of the solder on these wires was investigated (see Figure). Low-resistance ohmic contacts were observed across solder joints after reflow. Corrosion, oxidation, and intermetallic diffusion play a crucial role in solder reflow and joint formation at the nanoscale.