IEEE Design & Test of Computers · 1997 · 26 citations · 26 references
EngineeringComputer EngineeringPackaging DesignChip PackagingDevice ReliabilityDiagnosisFailure AnalysisFailure TheoriesFault DiagnosisDesign Failure AnalysisDevice Failure AnalysisFailure Data AnalysisFailure DiagnosisHardware Diagnostics
Advancing IC and packaging technologies motivate and direct the future of failure analysis. The authors review current tools and techniques and discuss challenges and opportunities created by the industry's critical need for new diagnosis and failure analysis paradigms.
26
Defect classes-an overdue paradigm for CMOS IC testing
C.F. Hawkins, J.M. Soden, Alan Righter et al. · 2002 · 203 citations · Full text
Engineering, Computer Engineering, Electrical Engineering +17
Current signatures [VLSI circuit testing]
Anne Gattiker, W. Maly · 2002 · 121 citations
Engineering, Computer Engineering, Electrical Engineering +11