Photoembossing of Periodic Relief Structures Using Polymerization‐ Induced Diffusion: A Combinatorial Study

Abstract

Photoembossing is a solvent-free photolithographic technique for the production of polymeric relief microstructures (see Figure). A combinatorial methodology to explore the influence of different parameters (e.g., processing temperature, binder content, photoinitiator content) on the resultant relief structure is presented using an acrylate-based model system. Results are discussed in the framework of a diffusion-polymerization model.