2012 · 26 citations · 4 references
EngineeringComputer EngineeringElectrical EngineeringMicroelectronicsSensorsSystem-on-chip DesignCmos Circuit DesignImage ProcessingImage SensorsIntegrated Circuit DesignPhotodetectorsSensor IntegrationCmos Fabrication ProcessesCmos Image SensorsComplementary Metal-oxide-semiconductor Image SensorsFill FactorImage Sensor TechnologyLow Earth OrbitsPixel ArchitecturePixel Pitch
In this paper, we report a novel Time-Delay-Integration (TDI) CMOS image sensor for low-earth orbit (LEO) nano-satellite imaging application, where limited exposure time and unexpected flight fluctuations are major design challenges. The sensor features programmable integration time per stage, dynamic charge transfer path and tunable well capacity. A prototype chip of 1536×8 pixels was implemented using TSMC 0.18µm CMOS image sensor process. Photodiode and other transistors are floor-planned in different arrays, providing small pixel pitch of 3.25µm and high fill factor of 57%.
4
CMOS TDI readout circuit that improves SNR for satellite IR applications
C.B. Kim, Chulsoon Hwang, B.H. Kim et al. · Electronics Letters · 2008 · 13 citations
Engineering, Computer Engineering, Electrical Engineering +17