Development Of An Optimal Sampling Strategy For Wafer Inspection

Abstract

This paper presents a methodology for the development of an optimal sampling strategy for defect inspection, which is crucial for yield management of state-of-the-art technologies. This requires understanding of the defect-yield relationship and yield reducing process drift models. Further, the sampling plan is based on the trade-offs between the costs of sampling and of defective dies. Our methodology is demonstrated using data from different fabs.