Dependency of dishing on polish time and slurry chemistry in Cu CMP

Atlas of electrochemical equilibria in aqueous solutions

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A Two‐Dimensional Process Model for Chemimechanical Polish Planarization

J. Warnock · Journal of The Electrochemical Society · 1991 · 106 citations

Engineering, Materials Engineering, Materials Science +9

Influence of Overpolish Time on the Performance of W Damascene Technology

H. van Kranenburg, P.H. Woerlee · Journal of The Electrochemical Society · 1998 · 25 citations

Engineering, Materials Engineering, Materials Science +13

The interaction between different barrier metals and the copper surface during the chemical-mechanical polishing

D. Zeidler, Z. Stavreva, Matthias Plötner et al. · Microelectronic Engineering · 1997 · 18 citations

Natural Sciences, Materials Engineering, Materials Science +16