Nano- and Microstructures for Thin-Film Evaporation—A Review

TLDR

Evaporation from thin films underpins processes such as energy conversion, microelectronics cooling, boiling, perspiration, and self‑assembly, and is governed by transport phenomena at the liquid–vapor–solid contact line. The article reviews the thin‑film evaporation panel discussion, summarizing key principles and conclusions from the workshop. The 2013 International Workshop convened experts to review state‑of‑the‑art micro‑ and nanostructures for phase‑change heat transfer and identify future research directions. Altering surface chemistry and topography at micro‑ and nanoscale can dramatically enhance vaporization.

Abstract

Evaporation from thin films is a key feature of many processes, including energy conversion, microelectronics cooling, boiling, perspiration, and self-assembly operations. The phase change occurring in these systems is governed by transport processes at the contact line where liquid, vapor, and solid meet. Evidence suggests that altering the surface chemistry and surface topography on the micro- and the nanoscales can be used to dramatically enhance vaporization. The 2013 International Workshop on Micro- and Nanostructures for Phase-Change Heat Transfer brought together a group of experts to review the current state-of-the-art and discuss future research needs. This article is focused on the thin-film evaporation panel discussion and outlines some of the key principles and conclusions reached by that panel and the workshop attendees.