All inkjet printed 3D microwave capacitors and inductors with vias

Abstract

For the first time we present a method to create all inkjet printed multilayer RF passive components including vias. Although there has been previous work on multilayer RF components, they are not fully inkjet printed and involve complicated processing techniques such as laser cutting, conductive epoxy, or reactive ion etching. This work demonstrates a truly all inkjet printed solution with a novel dissolving method for vias realization. A major issue with inkjet printing is often surface roughness, however by processing these materials at low temperature surface roughness <;20nm RMS has been obtained which allows for high quality components to be fabricated and allows for stacked multilayer designs.