Integrated Antennas on Silicon Substrates for Communication Over Free Space

Abstract

This letter reports the feasibility of using 2-mm-long on-chip antennas for communication over free space. Integration of antennas into radio frequency integrated circuits (RFICs) eliminates external transmission line connections and sophisticated packaging, which should lower the cost of wireless systems operating above 10 GHz. Mobile microwave probe stands have been developed for measurements at varying antenna pair separations. Antenna-pair gains for 2-mm-long integrated zigzag dipole antennas fabricated on 20-/spl Omega/-cm silicon substrates have been characterized near 24 GHz for separations up to 15 m. The antenna-pair gains show R/sup -2/ dependence up to /spl sim/4-5 m. The antennas were found to be sufficient for use up to 5 m and possibly larger separations.