Low-loss and stable fiber-to-waveguide connection utilizing UV curable adhesive

Abstract

A low-loss and stable fiber-to-waveguide connection was realized utilizing a newly developed UV curable epoxy resin which has improved humidity durability. The average connection loss was as low as 0.09 dB/point with a return loss of 46 dB. The loss increase was not observed after a heat-cycle test between -40 and 85 degrees C, a high-temperature test at 85 degrees C, or a low-temperature test at -40 degrees C. In a high-humidity test at 70 degrees C and 90% relative humidity, the loss increase was less than 0.2 dB after 400 h.< <ETX xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">&gt;</ETX>