Publication | Closed Access
Computation of transients in lossy VLSI packaging interconnections
24
Citations
4
References
1990
Year
Electrical EngineeringEngineeringDynamic BehaviorAdvanced Packaging (Semiconductors)Nonlinear CircuitVlsi ArchitectureComputer EngineeringComputer ArchitectureLarge Scale IntegrationTransmission LineCircuit SimulationModeling And SimulationElectronic PackagingMicroelectronicsCircuit AnalysisInterconnect (Integrated Circuits)Power Electronic DevicesNonlinear Termination
An efficient method for analyzing the dynamic behavior of lossy electrical interconnects (with frequency-dependent parameters) in very large scale integration (VLSI) systems is presented. The method allows for the inclusion of electrical interconnects which are terminated by networks of lumped passive (R,L,C) and active nonlinear devices such as diodes and bipolar and MOS transistors. The method consists of deriving the circuit model for a transmission line from impulse response data and incorporating this model into an existing computer program called UANTL which performs time-domain analysis for coupled transmission lines with nonlinear termination. Several numerical experiments with this method were performed. Comparisons are made between the results obtained using this method and previously published results.< <ETX xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">></ETX>
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