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Analysis of negative differential resistance in the I-V characteristics of shorted-anode LIGBT's
72
Citations
14
References
1991
Year
Device ModelingSemiconductor TechnologyElectrical EngineeringSemiconductor DeviceEngineeringHigh Voltage EngineeringPhysicsConductivity ModulationNegative ResistanceBias Temperature InstabilityApplied PhysicsShorted-anode LigbtI-v CharacteristicsMicroelectronicsNegative Differential ResistanceGate Bipolar Transistor
The physical mechanism responsible for the negative differential resistance (NDR) in the current-voltage characteristics of the shorted anode lateral insulated gate bipolar transistor (SA-LIGBT) is explained through two-dimensional numerical simulation. The NDR regime is an inherent feature of all SA-LIGBTs, and results from the two different conduction mechanisms responsible for current flow in the device. These conduction mechanisms are minority-carrier injection and majority-carrier flow. Since both the anode geometry and the doping profile control the onset and the degree of minority-carrier injection, the effect these parameters have on the NDR is investigated. A simple lumped-element equivalent model of the SA-LIGBT allows qualitative predictions to be made on how changes in the device geometry and doping profiles influence the NDR regime. It is shown that conductivity modulation is a necessary but not sufficient condition for the occurrence of negative resistance in SA-LIGBT devices. Also required is a large voltage drop in the high-resistivity drift region before conductivity modulation is initiated. This causes small changes in the anode current level, greatly decreasing the total resistance across the drift region.< <ETX xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">></ETX>
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