Studies on SiO2–SiO2 bonding with hydrofluoric acid. Room temperature and low stress bonding technique for MEMS - Concepedia

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Studies on SiO2–SiO2 bonding with hydrofluoric acid. Room temperature and low stress bonding technique for MEMS

76

Citations

2

References

2000

Year

Hiroyuki Nakanishi, T. Nishimoto, Ryuta Nakamura, A. Yotsumoto, T. Yoshida, Sunao Shoji

Sensors and Actuators A Physical

Materials ScienceRoom TemperatureEngineeringMicrofabricationSurface ScienceApplied PhysicsHydrofluoric AcidSilicon On InsulatorMicroelectronicsMicro-electromechanical System

References

	Year	Citations

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