Publication | Closed Access
Fatigue fracture mechanisms of Cu/lead-free solders interfaces
49
Citations
28
References
2009
Year
Materials ScienceEngineeringFatigue Fracture MechanismsCorrosionMechanical EngineeringSolid MechanicsElectronic PackagingCrack FormationDynamic Crack PropagationLow-cycle FatigueMechanics Of MaterialsMicrostructure
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