52.4: The High Deposition Rate and High Material Yield Evaporation Method for OLED Layers

Eiji Matsumoto, Shinichiro MAKI, Y. Yanagi, Taisuke Nishimori, Yukihiro Kondo, Y. Kishi, Junji Kido

SID Symposium Digest of Technical Papers · 2003 · 11 citations · 4 references

Concepts

Abstract

Abstract For reducing the manufacturing cost of Organic Light Emitting Diode (OLED) display, it has been necessary to develop new fabricating method such as the mass production equipment with higher throughput, higher material yield and good film thickness uniformity for larger substrates. In order to satisfy these requirements, a new marvelous technology, we call as “Hot‐Wall evaporation method”, was introduced. This method could achieve deposition rate of 20 Å/s, material yield of 70%, and film thickness uniformity of ±4% for both a 400mm width and a 100 mm square substrate. As a result we established the possibility of manufacturing the new mass production equipments which fabricate OLED at lower cost.

References

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