Journal of Micromechanics and Microengineering · 2001 · 95 citations · 7 references
Natural SciencesMaterials EngineeringMaterials SciencePolymer ChemistryPolymer EngineeringPolymer MaterialsDielectricsMicrofabrication ProcessesMicrofluidic DevicesThermogravimetric AnalysisThermosetsThermosetting PolymersFabricationMicrochannel DesignMicrochannel FabricationPolypropyleneSacrificial MaterialsSilicon DioxideThermogravimetric Data AnalysisThermoset Processing
The use of polycarbonates as thermally decomposable, sacrificial materials for the formation of microchannels is presented. Polycarbonates decompose in the temperature range of 200-300 °C. Two polycarbonates, polyethylene carbonate and polypropylene carbonate, have been used to fabricate microchannels in three different types of encapsulants: an inorganic glass (silicon dioxide), a thermoplastic polymer (Avatrel dielectric polymer) and a thermoset polymer (bisbenzoycyclobutene Cyclotene 3022-57). This paper presents the details of the fabrication process, a thermogravimetric analysis of the sacrificial materials, and the kinetic parameters for the decomposition process. The presence of oxygen or water was found to impact on the decomposition of the sacrificial material. This paper demonstrates the feasibility of forming buried air-cavities in a variety of encapsulants at a modest temperature, thus enabling the use of a wide range of dielectric materials with different thermal stabilities and properties.
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Air-gaps in 0.3 μm electrical interconnections
Paul A. Kohl, D. M. Bhusari, Michael D. Wedlake et al. · IEEE Electron Device Letters · 2000 · 55 citations
Natural Sciences, Electrical Engineering, Materials Science +17