2002 · 117 citations · 0 references
EngineeringVlsi DesignRadio FrequencyOff-chip L3Physical DesignComputer ArchitecturePower ElectronicsProcessor ArchitectureElectromagnetic CompatibilityComputational ElectromagneticsParallel ComputingManycore ProcessorElectrical EngineeringHigh-frequency DeviceXeon PhiAntennaComputer EngineeringMultiple ChipsMicroelectronicsMicrowave EngineeringSystem On ChipVlsiTechnologyMicroprocessor Cores
The fourth-generation POWER processor chip contains 170M transistors and includes 2 microprocessor cores, shared L2, directory for an off-chip L3, and all logic needed to interconnect multiple chips to form an SMP. It is implemented in a 0.18 /spl mu/m SOI technology, with 7 layers of Cu interconnect, and functions in systems at 1.1 GHz, and dissipates 115 W at 1.5 V.