Signature analysis for IC diagnosis and failure analysis

Abstract

A method of signature analysis is presented that is based on ATE data, experiential knowledge of failure modes and mechanisms, or a combination of both. This method can be used on low numbers of failures or even single failures. It uses the Dempster-Shafer theory to calculate failure mechanism confidence. This method can be used for rapid diagnosis of complex IC failures. The model is developed and an example is given based on Sandia's 0.5 /spl mu/m CMOS IC technology.