Data Compendium for Plasma-Surface Interactions

TLDR

The paper reviews particle‑solid processes relevant to plasma‑wall interaction modeling and provides recommended data sets. The authors compile analytic formulas where available and present data in tables and graphs for incident particles e⁻, H, D, T, He, C, O, and self‑ions on materials such as Al, Be, Cu, Mo, stainless steel, Ti, W, C, and TiC, covering processes including light ion reflection, hydrogen and helium trapping/detrapping, desorption, evaporation, sputtering, chemical sputtering effects, helium/hydrogen blistering, secondary electron emission, and arcing. The review yields a comprehensive compendium of recommended data for these processes, facilitating accurate plasma‑surface interaction modeling.

Abstract

A review of particle-solid processes pertinent to modelling plasma-wall interactions is presented, and sets of recommended data are given. Analytic formulas are used where possible; otherwise, data are presented in the form of tables and graphs. The incident particles considered are e − , H, D, T, He, C, O, and selfions. The materials include the metals aluminum, beryllium, copper, molybdenum, stainless steel, titanium, and tungsten and the nonmetals carbon and TiC. The processes covered are light ion reflection, hydrogen and helium trapping and detrapping, desorption, evaporation, sputtering, chemical effects in sputtering, blistering caused by implantation of helium and hydrogen, secondary electron emission by electrons and particles, and arcing.