Publication | Closed Access
Frequency multiplier measurements on heterostructure barrier varactors on a copper substrate
26
Citations
10
References
2000
Year
Copper SubstrateEngineeringFrequency Multiplier MeasurementsThermal ConductivityInterconnect (Integrated Circuits)Semiconductor DeviceElectromagnetic CompatibilityRf SemiconductorHeterostructure Barrier VaractorsNanoelectronicsElectronic EngineeringElectronic PackagingElectrical EngineeringThree-barrier Hbv MaterialPhysicsHigh-frequency DeviceMicroelectronicsApplied PhysicsMultilayer Heterostructures
We have fabricated heterostructure barrier varactors (HBV) on a copper substrate, which offers reduced spreading resistance, and improved thermal conductivity compared to an InP substrate. The devices are fabricated without degrading the electrical characteristics. The three-barrier HBV material grown by MOVPE has a leakage current of only 0.1 μA/μm <sup xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">2</sup> at 19 V. The maximum capacitance is 0.54 fF/μm <sup xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">2</sup> . In a frequency tripler experiment a maximum output power of 7.1 mW was generated at 221 GHz with a flange-to-flange efficiency of 7.9%.
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