Effect of grain growth stress and stress gradient on stress-induced voiding in damascene Cu/low-k interconnects for ULSI - Concepedia

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Effect of grain growth stress and stress gradient on stress-induced voiding in damascene Cu/low-k interconnects for ULSI

10

Citations

9

References

2005

Year

Jong-Min Paik, Il-Mok Park, Young‐Chang Joo

Thin Solid Films

Materials ScienceGrain Growth StressEpitaxial GrowthElectromigration TechniqueEngineeringSevere Plastic DeformationStress-induced VoidingApplied PhysicsMetallurgical InteractionStress GradientElectronic PackagingMicroelectronicsMicrostructure

References

	Year	Citations

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