Jong-Min Paik

Effect of low-k dielectric on stress and stress-induced damage in Cu interconnects

Jong-Min Paik, Hyun Park, Young‐Chang Joo · Microelectronic Engineering · 2004 · 75 citations

Materials Science, Electrical Engineering, Electromigration Technique +13

Anisotropy of grain boundary energies as cause of abnormal grain growth in electroplated copper films

Jong-Min Paik, Young-Joon Park, Min-Seung Yoon et al. · Scripta Materialia · 2003 · 34 citations

Materials Engineering, Materials Science, Electromigration Technique +11

Linewidth dependence of grain structure and stress in damascene Cu lines

Jong-Min Paik, Il-Mok Park, Young‐Chang Joo et al. · Journal of Applied Physics · 2006 · 31 citations

Engineering, Severe Plastic Deformation, Mechanical Engineering +17

Effect of dielectric materials on stress-induced damage modes in damascene Cu lines

Jong-Min Paik, Hyun Park, Young‐Chang Joo et al. · Journal of Applied Physics · 2005 · 25 citations

Engineering, Severe Plastic Deformation, Mechanical Engineering +22

Relationship between grain structures and texture of damascene Cu lines

Jong-Min Paik, Ki-Chul Park, Young‐Chang Joo · Journal of Electronic Materials · 2004 · 11 citations

Materials Science, Materials Engineering, Engineering +4