EngineeringComputer EngineeringComputer ScienceComputer ArchitectureComputer-integrated ManufacturingMicrofabricationChip PackagingIntegrated Circuit FabricationFabricationMultichip Modules
This paper details the history and development of MPC (Multi-Project Chip) Services available in various countries. The CMP French Service is also used to exemplify a few basic principles that should govern the management of such Services. Some of these principles have evolved during the last 10 years, especially when considering University oriented chip fabrication. Also the expected development of different technologies is addressed, to assess which of these technologies should be offered.