Effects of package parasitics on the performance of SAW filters

Abstract

Effects of package parasitics on the performance of SAW filters were evaluated. A quasi-static approach based on the finite difference method (FDM) in conjunction with the current simulation method (CSM) was used to extract lumped element parameter values of common interconnections that are found in typical SAW packages. The influence of bond wire connections and package leads on the performance of common interdigital transducers (IDTs) was evaluated.