Publication | Closed Access
The effect of copper additions on electromigration in aluminum thin films
127
Citations
15
References
1971
Year
Materials EngineeringMaterials ScienceElectromigration TechniqueEngineeringCorrosionApplied PhysicsThin FilmsElectronic PackagingChemical DepositionAluminum Thin FilmsCopper AdditionsAnodizing
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