Plasma Deposition of Silver Nanoparticles onto Stainless Steel for the Prevention of Fungal Biofilms: A Case Study on <i>Saccharomyces cerevisiae</i>

Abstract

Abstract A silver nanoparticle composite film was deposited onto stainless steel to reduce the adhesion strength of the model yeast S. cerevisiae . Deposition was carried out under cold‐plasma conditions, combining RF glow discharge and silver sputtering. Shear‐flow‐induced detachment experiments demonstrated the film's anti‐adhesive properties. However, the surface tended to undergo some chemical changes after use, such an increase in hydrophilicity. XPS analysis confirmed the presence of metallic silver for the native plasma‐modified surface and revealed silver oxidation after use. The silver content was also lowered, due to the progressive release of ionic silver from the composite into the medium. magnified image