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Frequency-dependent inductance and resistance calculation for three-dimensional structures in high-speed interconnect systems
53
Citations
12
References
1990
Year
EngineeringFrequency-dependent InductancesMicrowave TransmissionResistance CalculationThree-dimensional StructuresInterconnect (Integrated Circuits)Electromagnetic CompatibilityPhysical Design (Electronics)Computational ElectromagneticsFrequency-dependent InductanceElectronic Packaging3D Ic ArchitectureElectrical EngineeringHigh-frequency DeviceMicroelectronicsMicrowave EngineeringNumerical MethodTransmission LineMicrostrip Bends
Frequency-dependent inductances and resistances of three-dimensional structures commonly encountered in modern electronic interconnections are calculated by a combined finite-element/integral-equation method. the mathematical formulation and the numerical method of solution are discussed. Numerical results for microstrip bends and vias are presented. These results compare well with experiment. The effect of the frequency dependence of the inductance on pulse propagation is discussed.< <ETX xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">></ETX>
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