Low temperature adhesion bonding for BioMEMS

Abstract

A novel adhesive bonding technology has been developed based on the preparation of ultra-thin adhesive layers between precision machined cylinders and roll-to-surface print transfer onto micro-machined substrates. In contrast to many existing bonding technologies, this process is compatible with bio-functionalized devices since it operates at low temperatures and does not rely on cover plates previously pre-coated with adhesive. The process was initially developed for the bonding of glass/SU-8 structures to glass cover plates for the fabrication of micro-fluidic devices with integrated 3D-micro-electrode arrays. The precision of alignment is usually <2 µm. In addition, larger (6 inch) polymeric substrates with micro-machined channels have also been successfully bonded using this method.