IC failure analysis tools and techniques-magic, mystery, and science

Abstract

This review includes a discussion of the advances being made to meet the challenges presented by state-of-the-art IC and packaging technologies, since these provide the motivation and direction for the future of FA. New capabilities are required for ICs with features such as additional interconnection layers, power distribution planes, or flip chip packaging that reduce or prevent the use of conventional methods without destructive deprocessing. To support improved time to market and yield enhancement, the industry needs diagnostic techniques that provide logical and physical localization in real time during production testing.