Modular microchannel cooled heatsinks for high average power laser diode arrays

Abstract

Detailed performance results for an efficient and low thermal impedance laser diode array heatsink are presented. High duty factor or CW operation of fully filled laser diode arrays is made possible at high average power. Low thermal impedance is achieved using a liquid coolant and laminar flow through microchannels. The microchannels are fabricated in silicon using an anisotropic chemical etching process. A modular rack-and-stack architecture is adopted for the heatsink design, allowing arbitrarily large two-dimensional arrays to be fabricated and easily maintained. The excellent thermal control of the microchannel cooled heatsinks is ideally suited to pump array requirements for high average power crystalline lasers.< <ETX xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">&gt;</ETX>