SiC Wirebond Multi-Chip Phase-Leg Module Packaging Design and Testing for Harsh Environment

Abstract

In order to take full advantage of SiC, a high temperature wirebond package for multi-chip phase-leg power module using SiC devices was designed, developed, fabricated and tested. The details of the material selection and thermo-mechanical reliability evaluation are described. High temperature power test shows that the package presented in this paper can perform well at the high junction temperature.