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Mechanical and thermal characterization of a novel nanocomposite thermal interface material for electronic packaging

Materials ScienceEngineeringNanomaterialsMechanical EngineeringThermal TransportThermal AnalysisThermal CharacterizationThermal ConductionHeat TransferElectronic PackagingThermal EngineeringThermal ConductivityThermal PropertyThermal Properties