2002 · 11 citations · 1 references
EngineeringElectrical EngineeringMaterials ScienceFinite Element AnalysisHeat TransferThin FilmsHeat ConductionHeat Transfer AnalysisHeat Transfer ModelingThermal DesignThermal Properties Of MaterialsThermal Resistance NetworksFinite Element ModelingFinite Element Thermal ModelingHeat Conduction EquationMultichip ModulesNumerical ModelingThermal Modeling Of Thin FilmsThermal Network ModelingThermal Resistance
A semi-analytical model is presented for evaluating the thermal resistance of via networks used in thin film multichip modules. Correlations between dimensionless groups were derived from numerical data. Therefore, the via network was divided in three basic elements. This allows one to reconstruct the network as a series and parallel connection. The results of this semi-analytical model are compared with those of an existing analytical model and a 3D finite element model. Good agreement between the three models was obtained. The heat conduction efficiency of a staggered thermal via network is defined and the influence of several parameters was investigated.< <ETX xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">></ETX>
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