Ultrasonic Ball/Wedge Bonding of Aluminium Wires

Abstract

The process of ball/wedge bonding and its advantages are described. A capacitor discharge technique for the formation of balls on 25 and 75 μ m diameter aluminium wires is discussed. Ultrasonic welding trials were carried out and the bonds subjected to pull tests with good results. Bonds of good strength were made between 25 μ m diameter Al‐1% Si wire and Al thin films, Pd‐Au thick films and Au flashed Kovar.