Journal of The Electrochemical Society · 1997 · 30 citations · 0 references
Natural SciencesMaterials EngineeringMaterials ScienceCeramic MaterialsElectronic MaterialsThin FilmsDielectric MaterialsFerroelectric CeramicsFerroelectric MaterialsMemory DevicesThin Film Electrical PropertiesThin-film MaterialsDielectric ConstantFerroelectric Thin FilmsFerroelectricityLeakage CurrentMagnetron SputteringNonvolatile MemoryNonvolatile Memory DevicesRadio Frequency Sputtering
Fatigue‐free Bi‐layer films were deposited on substrates by radio frequency magnetron sputtering. The addition of 30 mole percent (m/o) and 20 m/o into the target was necessary in order to compensate for the lack of Sr and Bi in the films. A 200 nm thick film annealed at 800°C exhibited dense morphology, a dielectric constant of 210, and a dissipation factor of 0.06 at a frequency of 1 MHz. The remnant polarization 2Pr and the coercive field 2Ec of the films were 9.1 μC/cm2 and 85 kV/cm, respectively, at an applied voltage of 5 V. The leakage current density was about at 150 kV/cm. The films showed fatigue‐free characteristics under a ±5 V bipolar square pulse of 1 MHz up to . The films prepared by radio frequency magnetron sputtering are attractive for application to nonvolatile memory devices.