Use of surface insulation resistance and contact angle measurements to characterize the interactions of three water soluble fluxes with FR-4 substrates

Abstract

Soldering flux chemistry and its interaction with the printed wiring board have been important reliability concerns for a number of years. Post Vietnam investigation of military hardware revealed corrosion in some areas. The test method most frequently used to assess the corrosion potential of flux residues is surface insulation resistance (SIR) testing. This paper gives some background on surface insulation resistance testing and reports on its application to three different water soluble fluxes. The appearance of surface dendrites is linked to test procedures that allowed water condensation on the board surface. Subsurface conductive anodic filament formation is associated with the use of fluxes which contained polyglycols. The use of contact angle measurements to assess the effect of the soldering flux residues on the board is demonstrated.